pk095 (v1.4) july 20, 2010 www.xilinx.com 1 ?2006? 2010 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are tradema rks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners. average weight: 18.5g pk095 (v1.4) july 20, 2010 100% material declaration data sheet FFG1513 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 1.06135 5.74 silicon 7440-21-3 100.00 1.06135 solder bump 0.05432 0.29 tin 7440-31-5 63.00 0.03422034 lead 7439-92-1 37.00 0.02009766 underfill 0.0440 0.25 epoxy resin a 9003-36-5 20.00 0.008800 epoxy resin b 25068-38-6 3.00 0.001320 silica 60676-86-0 70.00 0.030800 hardener 19900-65-3 7.00 0.003080 heat spreader 3.0000 16.22 copper 7440-50-8 99.90 2.99700 nickel 7440-02-0 0.10 0.00300 heat spreader adhesive 0.053 0.28 organopolysiloxane mixture 100.00 0.053000 substrate 13.32398 72.03 copper 7440-50-8 46.91 metal layer 6.25027996 nickel 7440-02-0 0.52 metal layer 0.06928471 gold 7440-57-5 0.12 metal layer 0.01598878 bt (core) 13676-54-4/ 25722-66-1 28.00 3.73071496 glass fiber 65997-17-3 10.50 1.39901811 halogen fire retardant n/a 5.25 0.69950906 solder mask trade secret 8.70 1.15918643 solder balls 0.96318 5.21 tin 7440-31-5 95.50 0.91983690 silver 7440-22-4 4.00 0.03852720 copper 7440-50-8 0.50 0.00481590
100% material declaration data sheet FFG1513 pk095 (v1.4) july 20, 2010 www.xilinx.com 2 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the produ ction, test and assembly of hardware devices to independent third-party vendors and materials supplie rs (?contractors?). all data provided hereunder is based on information received from contractors. xili nx has not independently verified the accuracy or completeness of this information which is provided so lely for your reference in connection with the use of xilinx products. date version description of revisions 3/14/06 1.0 initial xilinx release. 6/06/06 1.1 100% material declaration. 6/19/06 1.2 updated component descriptions. 9/22/06 1.3 updated component descriptions and weights. 7/20/10 1.4 updated heat spreader substance description.
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